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发明名称
MULTILAYER CHIP COMPONENT AND ITS MANUFACTURE
摘要
申请公布号
JPH11340082(A)
申请公布日期
1999.12.10
申请号
JP19980146999
申请日期
1998.05.28
申请人
TAIYO YUDEN CO LTD
发明人
MORI TAKESHI
分类号
H01G4/30;(IPC1-7):H01G4/30
主分类号
H01G4/30
代理机构
代理人
主权项
地址
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