| 摘要 |
PROBLEM TO BE SOLVED: To provide a macro-inspection method for accurately detecting macro- abnormality by a simple processing. SOLUTION: At first, a semiconductor wafer image is picked up, and a picked up image is inputted (a step 11). The picked up image is second-dimensional Fourier transformed, and frequency components corresponding to a pattern cell and a noise are removed from the power spectrum, and a pre-processed image is generated by the second-dimensional inverse Fourier transformation (a step 12). A multi-stage resolution image is generated from the pre-processed image, and a range filter processing and a binarization processing is performed to each image so that density non-uniformity can be extracted (a step 13). |
