PRINTHEAD THERMAL COMPENSATION METHOD AND APPARATUS

摘要

The invention described in the specification relates to an apparatus and method for cooling a print head containing multiple semiconductor substrates. The substrates which contain a plurality of energy imparting devices (156) for energizing ink are attached to a metal substrate carrier for providing efficient heat transfer from the substrates. A temperature sensing device (140) is attached to the carrier for measuring a temperature of the substrate carrier during a printing operation and for generating an input signal to a controller (150). The controller, in turn, sends an output signal to the print head to selectively energize one or more of the energy imparting devices (156) on each substrate in response to the input signal and a thermal expansion value based on the temperature of the heat transfer member.