| 发明名称 |
SOLDER RESIST WINDOW CONFIGURATIONS FOR SOLDER PASTE OVERPRINTING |
| 摘要 |
There is disclosed herein an electronic circuit assembly, such as a printed circuit board, having solder resist windows with one or more enlarged solder resist pullback zones, thereby facilitating solder paste overprinting. |
| 申请公布号 |
CA2273662(A1) |
申请公布日期 |
1999.12.08 |
| 申请号 |
CA19992273662 |
申请日期 |
1999.06.07 |
| 申请人 |
FORD MOTOR COMPANY OF CANADA LIMITED |
发明人 |
JAIRAZBHOY, VIVEK;MCMILLAN, RICHARD |
| 分类号 |
H05K3/34;(IPC1-7):H05K1/02;H05K3/00 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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