| 摘要 |
<p>The invention describes an improved method for making a printhead for an ink jet printer. In the method, one or more semiconductor substrates (54) containing energy imparting devices are attached to a metal substrate carrier (60). A conductive layer (70) containing electrical tracing (52) terminating in contact pads is also attached to the carrier using an adhesive (72). A nozzle plate (64) is attached to the conductive layer and to the semiconductor substrate also using an adhesive. The nozzle plate, conductive layer and adhesive all have openings or windows (68, 76) therein for use in forming wire bonds (56, 58) between the semiconductor substrate and the conductive layer. Once the wire (50) bonds having loops are formed, the wire loops are depressed toward the nozzle plate to reduce the height of the loops above the nozzle plate. The entire wires and bonds are then encapsulated in an elastomeric, insulative material to protect the wires. An advantage of the depressed wire loops is that the encapsulating material layer may be relatively thin so that it does not extend above the exposed surface of the nozzle plate more than 15 mils thereby providing maximum clearance between the printhead and the media to be printed or paper.</p> |
