| 摘要 |
PROBLEM TO BE SOLVED: To unify the grinding quantity of a wafer, and increase the grinding quantity. SOLUTION: A back side pad 15 is fixed to a base plate 11 of a head, and compressed air is fed between a polishing pad 8 and a wafer 16 pressed against the polishing pad from an air pipe 13. An outer circumferential part 152 of the back side pad 15 is formed of a closed cell foam, and its center part 151 is formed of an open cell foam. Reduction in the grinding quantity of the outer circumferential edge part of the wafer is prevented, and the wafer can be uniformly and generally ground. |
