| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition continuously exhibiting excellent mold releasability in molding and having improved transparency and reliability against humidity by compounding an epoxy resin, a curing agent, a curing accelerator and a specific mold releasing agent obtained by ethoxylating a montanic acid wax. SOLUTION: A montanic acid wax of formula I (wherein m is 27-31) is ethoxylated to give a mold releasing agent of formula II (wherein m is 27-31; and n is at least 4) having an ethoxylation ratio of 25-90 wt.%. With 100 pts.wt. of an epoxy resin composition for an optical semiconductor comprising an epoxy resin containing at least two epoxy groups in the molecule, a curing agent in an amount such that the equivalent ratio thereof to the epoxy resin is 0.5-5, preferably 0.7-1.3, and a curing accelerator are compounded 0.1-5 pts.wt. of the mold releasing agent and, if required, inorganic fillers, discoloration inhibitors, antioxidants, flame retarders, colorants, modifiers, plasticizers, diluents and the like. The resulting compound is subjected to heating and kneading using a high speed agitator, a triple roll mill or the like followed by cooling, pulverizing and, if required, tableting. |
