Werkwijze voor het verbinden van geleiders, bevestigd in het frame van een elektrisch ketenpakket, met een eerste groep elektroden.

摘要

In a package (20) containing a semiconductor or an integrated circuit chip (10), an insulating layer (12) is deposited on the chip (10), and a group of electrodes (13) are deposited on the insulating layer (12). The group of electrodes (13) are generally larger than the internal electrodes (11) of the chip (10) and are coupled to selected ones of the internal electrodes (11). The larger electrodes (13) permit the conducting leads (21) of the package (20) to project into the interior of the package (20) and be applied directly to the smaller electrodes (11) when the package (20) is assembled. The electrodes (13) and the package leads (21) are wetted with an appropriate preferably solder type alloy (22) to permit convenient electrical coupling. The electrodes and the package leads are properly shaped, to make the assembly process not dependent on the area.