发明名称 |
METHOD FOR INNER LEAD MANUFACTURING IN FINE PITCH LEADFRAME |
摘要 |
A method of fabricating the inner leads of a fine pitch leadframe having a small interval between leads. The inner leads of the fine pitch leadframe are fabricated by combining a new stamping tool for fabricating extended fine pitch portions of inner leads with an existing stamping tool for fabricating the inner leads of a leadframe. This method obviates the time and expense of manufacturing an entirely new stamping tool. |
申请公布号 |
KR100231837(B1) |
申请公布日期 |
1999.12.01 |
申请号 |
KR19970018331 |
申请日期 |
1997.05.12 |
申请人 |
SAMSUNG TECHWIN CO.,LTD. |
发明人 |
KIM, YONG-YOUN;AHN, TAE-YONG |
分类号 |
H01L21/50;H01L21/48;H01L23/495;H01L23/50;(IPC1-7):H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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