发明名称 METHOD FOR INNER LEAD MANUFACTURING IN FINE PITCH LEADFRAME
摘要 A method of fabricating the inner leads of a fine pitch leadframe having a small interval between leads. The inner leads of the fine pitch leadframe are fabricated by combining a new stamping tool for fabricating extended fine pitch portions of inner leads with an existing stamping tool for fabricating the inner leads of a leadframe. This method obviates the time and expense of manufacturing an entirely new stamping tool.
申请公布号 KR100231837(B1) 申请公布日期 1999.12.01
申请号 KR19970018331 申请日期 1997.05.12
申请人 SAMSUNG TECHWIN CO.,LTD. 发明人 KIM, YONG-YOUN;AHN, TAE-YONG
分类号 H01L21/50;H01L21/48;H01L23/495;H01L23/50;(IPC1-7):H01L21/50 主分类号 H01L21/50
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