Method and apparatus for selectively marking a semiconductor wafer

摘要

A method and apparatus that accurately marks a wafer (102) at selected locations such as a defect location on the surface of a wafer such that a wafer analysis system (e.g., SEM or AFM) may rapidly find the defect. The apparatus contains a wafer platen (108) for retaining a wafer (102) in a substantially horizontal orientation and a marking assembly (104) mounted above the wafer platen. The marking assembly further contains an optical microscope (114) and a marking head (116). In operation, a user locates a defect using the optical microscope (114) and places a pattern of fiducial marks at a predetermined distance from the defect, e.g., four marks in a diamond pattern circumscribing the defect.