Method for cleaning semiconductor wafers with an external heat source

摘要

A method of cleaning semiconductor wafers by use of a heat source external to the system is disclosed. The semiconductor wafers are disposed within a vacuum chamber having a transmissive window, and a radiant heat source external to the chamber is applied so that the radiation passes through the window onto the semiconductor wafers. The invention has particular application to semiconductor wafers used for photocathodes and image intensifier tubes.