发明名称 REACTIVE ION ETCHING METHOD AND APPARATUS THEREOF
摘要 PROBLEM TO BE SOLVED: To enable adaptation to fine machining at specified width by obtaining the etching condition to maximize the relative values of the peak intensities of CHF2 <+> ions with respect to the intensities of monitored various kinds of ions and optimizing the etching sectional shape near the obtained etching condition. SOLUTION: A mass spectrometer 14 is disposed near a substrate electrode to monitor various kinds of ions generated in a plasma, the etching condition is obtained so as to maximize the relative values of the peak intensities of CHF2 <+> ions with respect to the intensities of various kinds of ions, the etching sectional shape is optimized near the obtained etching condition, which is composed of a gas mix ratio, discharge power and pressure, the gas mix ratio is set so as to maximize the relative value of the peak intensities of CHF2 <+> ions, and one kind of the mixed used gases is hydrogen or carbon fluoride which contain hydrogen. As a result, this method can be adapted to fine machining of 0.3 &mu;m or smaller width.
申请公布号 JPH11330052(A) 申请公布日期 1999.11.30
申请号 JP19980135566 申请日期 1998.05.18
申请人 ULVAC CORP 发明人 CHIN TAKASHI;ITO MASAHIRO;HAYASHI TOSHIO
分类号 H05H1/46;C23F4/00;H01L21/302;H01L21/3065 主分类号 H05H1/46
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