发明名称 SEMICONDUCTOR CHIP RELEASING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor chip releasing device, capable of releasing a semiconductor chip from a dicing tape without damaging the semiconductor chip. SOLUTION: A dicing tape 4 is attracted and fixed on an attracted stand 2, a semiconductor chip 5 attracted on this dicing tape 4 is attracted by a vertically movable collet 3 and the semiconductor chip 5 is released from the dicing tape 4. Concerning such a semiconductor chip releasing device, a projected body 6 composed of a magnetic substance is arranged on the chucking stand 2 so as to freely move vertically down, and on the other hand, the collet 3 is arranged with a magnetic force attracting means 8 for attracting the projected body 6 with magnetic force.</p>
申请公布号 JPH11330012(A) 申请公布日期 1999.11.30
申请号 JP19980138344 申请日期 1998.05.20
申请人 ROHM CO LTD 发明人 KIKUCHI NORIAKI
分类号 H01L21/67;H01L21/301;H01L21/68;(IPC1-7):H01L21/301 主分类号 H01L21/67
代理机构 代理人
主权项
地址