摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor chip releasing device, capable of releasing a semiconductor chip from a dicing tape without damaging the semiconductor chip. SOLUTION: A dicing tape 4 is attracted and fixed on an attracted stand 2, a semiconductor chip 5 attracted on this dicing tape 4 is attracted by a vertically movable collet 3 and the semiconductor chip 5 is released from the dicing tape 4. Concerning such a semiconductor chip releasing device, a projected body 6 composed of a magnetic substance is arranged on the chucking stand 2 so as to freely move vertically down, and on the other hand, the collet 3 is arranged with a magnetic force attracting means 8 for attracting the projected body 6 with magnetic force.</p> |