| 摘要 |
PROBLEM TO BE SOLVED: To indirectly and accurately position a substrate, without contacts by positioning the substrate to be carried via a carrier for fixing and retaining it in a given state. SOLUTION: A substrate carrier 11 is provided, where it has substrate- pressing metal fittings 14 and 15, that are slidable in a direction close to or away from a carrier block 12, and one end or the other end of a plurality of coil springs is sealed between the carrier block 12 and the substrate-pressing metal fittings 14 and 15. A printed wiring board 2 is positioned at each of positioning units 3A-6A of a printing machine and first to third chip mounters of a packaging system via a conveyor, while being fixed and retained at the substrate carrier 11. As a result, each reference hole and each end face formed on the printed wiring board 2 are prevented from being worn out or damaged. |
