| 摘要 |
A semiconductor package includes at least one structure having a central hole formed at a center portion of the structure, a plurality of outer holes around the center hole, and a plurality of conductor pieces buried in the outer holes; at least one TAB having lead lines extending from sides of the TAB, the TAB having a configuration substantially corresponding to the central hole of the structure and formed over the central hole of the structure; and a molding material covering at least a portion of the TAB.
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