| 摘要 |
PROBLEM TO BE SOLVED: To allow mounting of a large semiconductor chip on a small semiconductor package while wire bonding to an inner lead on a semiconductor chip is eliminated for sufficient length of the inner lead. SOLUTION: Related to a semiconductor device wherein an insulating tape 2 is provided on the upper surface of a semiconductor chip 1 with a tip end part of a lead 3 on the insulating tape 2, while the tip end of an inner lead 3a of the lead 3 is electrically connected to each electrode 1a of the semiconductor chip 1, a wiring 6 extending as far as the side of the insulating tape 2 is provided on the upper surface of the tape 2, and with the wiring 6 in between, the tip end of the inner lead 3a of each lead 3 whose tip end part is allocated on the insulating tape 2 is electrically connected to each electrode 1a of the semiconductor chip 1. |
