| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for forming a circuit pattern, and a multilayer wiring board being formed by that method, in which charged powder for forming circuit does not adhere to other part than the circuit pattern forming part nor the charging powder is missed from the circuit pattern even if it is formed on a matter to be printed by electrophotographic method. SOLUTION: The method for forming a circuit pattern comprises a first process for applying charged powder for forming circuit onto a ceramic green sheet, and a second process for removing the charged powder adhering to other part than the circuit pattern forming part on the ceramic green sheet. The first process comprising first charging step (a), exposing step (b), developing step (c) and transfer step (d) and the second step comprises second charging step (e), exposing step (f), removing step (g) and fixing step (h).</p> |
