| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for analysing a thermal breakdown phenomenon of a metal thin film using thermal conduction and microscopic and statistical decomposition processes of the thin film by a computer, and to provide a computer-readable recording medium which has a program for executing the method recorded in it. SOLUTION: An electron emission element thin film part having a substrate, a pair of element electrodes arranged oppositely on the substrate, and a conductive thin film arranged between the element electrodes is divided into micro cells, then thermal conductivity equations and electric circuit equations are alternately solved to obtain a temperature T of each cell of the thin film. The electric conductivity of each cell is varied using probability of change, including the prescribed expression exp(-Te /T) for activating energy Te with respect to the temperature and structural change. Thus, analysis is performed which takes into consideration the probabilistic factors with respect to the thermal conductive phenomenon and the structural change of the metal thin film which plays an important roles in the breakdown phenomenon of the metal thin film. |
