发明名称 ELECTRONIC PART MOUNTER AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic part mounting device which can lessened in manufacturing cost by enabling nozzles implanted in a head to have a vacuum pump in common and an electronic part mounting method capable of transferring and mounting an electronic part vacuum-chucked by a normal other nozzle even when any nozzle is vacuum-broken. SOLUTION: A head 10 is equipped with nozzles 11. The nozzles 11 are each connected to a vacuum tank 23 through individual valves 21 and tubes 22 which are separated from each other, and the vacuum tank 23 is connected to a vacuum pump 24. Even if any nozzle 11 leaks due to that a chip is not present or a chip is kept wrong in position, the leaking nozzle is restrained from adversely affecting the other normal nozzles 11 because the vacuum tank 23 of large capacity is interposed between the leaking nozzle 11 and normal nozzles 11.
申请公布号 JPH11330788(A) 申请公布日期 1999.11.30
申请号 JP19980125701 申请日期 1998.05.08
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIDESE WATARU;SHIODA NAOYUKI
分类号 B23P21/00;B25J15/06;H05K13/04 主分类号 B23P21/00
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