| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming a salient pole, without restriction on providing common electrodes for forming the salient pole and without the need for a flux at the forming of the salient pole and an electrode forming component. SOLUTION: An IC to be bonded and solder balls are exposed to a mixed gas of an HF gas from an HF gas supply unit 24 and a steam from a steam generator 26 at a fluoriding units 12 and 14, and is fluorided on the surface and then disposed at a bonding unit 16. Thereafter, an Ar gas atmosphere is provided in a chamber 32, a connecting conducting unit and the ball are pressurized by a cylinder 40, heated to melting points or lower of the both by a heater 44, and bonded. |
