| 摘要 |
PROBLEM TO BE SOLVED: To keep uniform the temperature of a waveguide chip as a whole by giving a curvature, which is approximately equal to that of the junction face of the waveguide tip, to the junction face to the waveguide tip of an soaking plate. SOLUTION: A face 9a, which is to be jointed to a waveguide chip 6, of a soaking plate 9 made of copper having high thermal conductivity is ground into a projecting shape, and its radius of warping is made approximately equal to that of the waveguide tip. Si paste is packed between the soaking plate 9 and the waveguide chip 6, and a thermosetting adhesive is charged from an adhesive charging part 9d to fix the soaking plate 9 and the waveguide chip 6. A top plate 10 adhered to the waveguide chip 6 reinforces the connection part to an optical fiber end part 11 to which a glass block has been added. As a result, the soaking plate 9 and the waveguide tip 6 are jointed with a uniform gap over the entire junction face. Consequently, if this soaking plate 9 is used to produce an optical module, heat in uniformly transmitted over the entire junction face, and the waveguide tip 6 becomes a uniform temperature over the entire surface. |
