Ultra-fine gold alloy wire for wire bonding or flip-chip bonding of semiconductor devices

摘要

An ultra-fine wire, used for contacting of semiconductor devices, consists of a gold-nickel alloy optionally containing alkaline earth and/or rare earth metals. An ultra-fine gold-nickel alloy wire, for contacting of semiconductor devices, consists of: (a) an alloy of gold and 0.6-2 wt. % nickel or (b) an alloy of composition 0.1-2 wt. % nickel, 0.0001-0.1 wt. % one or more alkaline earth and/or rare earth metals and balance gold. An Independent claim is also included for production of the above ultra-fine wire by continuous casting, drawing and annealing.