发明名称 METHOD FOR ELECTRO COPPERPLATING SUBSTRATES
摘要 A method for electro copperplating substrates, using insoluble anodes in aci d copper baths and a separate supply of used copper ions. The inventive method is characterized in that the bulk of the copper ions are supplied directly without the aid of diaphragms and auxiliary electrodes in the form of copper carbonate and/or basic copper carbonate in a separate tank which is directed towards the working electrodes via a bypass, whereby the gaseous CO2 thus released is separated in the separate tank.
申请公布号 CA2331750(A1) 申请公布日期 1999.11.25
申请号 CA19992331750 申请日期 1999.05.14
申请人 BLASBERG OBERFLACHENTECHNIK GMBH 发明人 BREITKREUZ, EUGEN;SCHMERGEL, ULRICH;HUPE, JURGEN;KRONENBERG, WALTER
分类号 C25D3/38;C25D21/14;H05K3/24;(IPC1-7):C25D21/14 主分类号 C25D3/38
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