| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer holding plate for a wafer polishing device to be excellent in heat resistance, thermal impact resistance and cope with the increase of a wafer bore, improvement of precision, and enhancement of quality. SOLUTION: This wafer holding plate 6 constitutes a wafer polishing device 1 togetherwith a table 2. This plate 6 holds a semiconductor wafer 5 at a holding surface 6a itself so that the semiconductor 5 is brought into slide contact with the polishing surface 2a of the table 2. This plate 6 is a dense substance made of a silicon carbide sintered substance having density of 2.7 g/cm<3> or more and thermal conductivity is 30 d/mK or more. |
