IC positioning device in IC socket

摘要

A device is provided for positioning an IC having a plurality of leads arranged in array along side surfaces of an IC body. The IC positioning device in an IC socket comprises a locator for pressing an outer side surface of a lead located on an extreme arraying end of the lead array group. The locator is moved while pressing side surfaces of leads which are displaced in an array direction, so that the lead array group and the IC body are moved to predetermined positions.