Method of processing a substrate utilizing specific chuck

摘要

A substrate (10) having a central region (32) and a peripheral region (34) is processed using a chuck (40) that contacts peripheral regions (34) of the substrate but not the central region. A fabrication step is performed while the substrate (10) is on the chuck (40, 60, 70). The chuck can be used in the formation of a lithographic mask or a semiconductor device.