Segment connections for multiple elevation transducers

摘要

A connection assembly for use in a multiple aperture ultrasonic transducer including an array of elements for transmitting and receiving wherein each element includes a plurality of segments and the connection assembly interconnects the segments of the elements and the segments to transmit/receive circuits to form the apertures of the array. The connection assembly includes an isolating layer superimposed on the segments with at least one via opening located within the area of each segment and a conductive layer superimposed on the isolating layer with conductive paths interconnecting the segments and the segments to the transmit/receive circuits to form the apertures of the array. The conductive layer forms a continuous layer covering the isolating layer, the interior surfaces of the via openings and the areas of the segments exposed through the via openings and is scribed to divide the conductive layer into the conductive paths. The conductive paths associated with each element are separated from the conductive paths associated with neighboring elements by the dicing cuts that divide the elements and segments from one another. A flex circuit is assembled coplanar with the segments and the isolating and conductive layers are superimposed on the elements and flex circuit so that the connections between the segments and flex leads are accomplished by the same processes.