Semiconductor device of lead-on-chip structure

摘要

In a semiconductor device of a lead-on-chip structure, each of inner leads has a lower surface in direct contact with a principal surface of a semiconductor chip in a wiring bonding region, and the lower surface of each inner lead has a recess formed at a place different from the wiring bonding region. An adhesive double coated tape is accommodated in the recess of each inner lead for sticking the inner leads to the principal surface of the semiconductor chip. Each of bonding wires has one end connected to a corresponding electrode pad on the principal surface of the semiconductor chip and the other end connected to an upper surface of a corresponding inner lead within the wire bonding area.