发明名称 |
Method of making compact integrated microwave assembly system |
摘要 |
The invention relates to a method for producing low cost integrated microwave assemblies, where a photoresist layer is deposited onto a substrate, a portion of the photoresist is selectively removed, a first conductive layer is applied, and, a second portion of the photoresist is removed leaving isolation walls and cavities. Electrical components are placed in the cavities and a first dielectric layer fills the cavities. Vias are created in the first dielectric material exposing the electrical contacts, a second conductive layer is applied into the vias and over the first dielectric material. The second conductive layer is patterned by removing a portion of the second conductive layer creating a signal line pattern in the second conductive layer.
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申请公布号 |
US5987732(A) |
申请公布日期 |
1999.11.23 |
申请号 |
US19980137288 |
申请日期 |
1998.08.20 |
申请人 |
TRW INC. |
发明人 |
LEE, ALFRED E.;DAVIDHEISER, ROGER A.;LAU, JAMES C. |
分类号 |
H05K3/46;H01L21/50;H01L23/552;H01L23/66;H01L25/00;H01L25/04;H01L25/18;H01P11/00;H05K1/02;H05K1/18;H05K3/00;(IPC1-7):H01P11/00 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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