发明名称 FIBER REINFORCED THERMOPLASTIC MOLDING MATERIAL AND HOUSING FOR ELECTRONIC/ELECTRIC EQUIPMENT USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To obtain a thin molding material which is high in strength and rigidity and excellent in electromagnetic wave shielding, appearance, and design by a method in which a reinforcing fiber fabric is impregnated with a thermoplastic resin in order to have specified values or above of flexural modulus of elasticity, flexural strength, and impact absorption energy. SOLUTION: In a fiber reinforced thermoplastic resin material, a reinforcing fiber fabric is impregnated with a thermoplastic resin. Its flexural modulus of elasticity is 15 GPa or above; flexural strength is 30 MPa or above; impact absorption energy is 15 J/mm. In addition, the reinforcing fiber volume ratio is 30-60%, and the warp and weft numbers of the fabric are 0.5-10/inch. In this way, the fiber reinforced thermoplastic resin molding material is excellent in strength, rigidity, and impact resistance as compared with an injection molded article, and can control surface defects such as pits and obtain a good appearance with a fold passed through.</p>
申请公布号 JPH11320737(A) 申请公布日期 1999.11.24
申请号 JP19980131852 申请日期 1998.05.14
申请人 TOYOBO CO LTD 发明人 NAGO SATOSHI;YAMANE MASAMUTSU;ONO OSAMU
分类号 B29B11/16;B29B15/10;B29C70/10;B29K101/12;B29K105/08;B29L31/34;B32B5/28;G06F1/16;(IPC1-7):B32B5/28 主分类号 B29B11/16
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