| 摘要 |
The invention concerns a device for positioning a semiconductor wafer (2) provided with a positioning mark (3) and placed in a support designed to house a plurality of semiconductor wafers, said device comprising an arm for grasping the wafer, means for moving the arm, the latter including: means for grasping the semiconductor wafer peripheral portion; means for directing the wafer co-operating with the grasping means so as to place the positioning mark in a predetermined position. The means for moving (120) the prehensile arm (1) comprise means for displacement along three spatial directions (X, Y, Z), the grasping means (5) and the directing means (6) being arranged on a rigid structure (7), the grasping means being distributed over the semiconductor wafer peripheral portion perimeter.
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