| 摘要 |
<p>The invention concerns a dry process surface treatment method for treating at least a metal surface portion, wherein the portion is treated at a pressure close to atmospheric pressure with a treating gas stream comprising excited and unstable species, which consists in locally increasing the treating gas pressure on the metal surface portion so as to force the l species to move along a direction substantially perpendicular to the surface. The invention is useful for wave brazing electronic components on printed circuit wafers.</p> |
