发明名称 PRODUCTION OF COPPER-SILVER COMPOSITE POWDER FOR ELECTRICALLY CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a method for producing copper-silver composite powder for electrically conductive paste exhibiting electrical conductivity close to that of silver. SOLUTION: Copper powder is mixed with, by weight, 3 to 50% silver oxide, the copper powder is mechanically bonded to the silver oxide while pulverizing is executed, and, thereafter, reducing treatment is executed at 120 to 400 deg.C to obtain powder of <=100μm particle size and >=2000 cm<2> /g specific surface area value in a BET method. In the process of the pulverizing, <=1% fatty acid is added, or before the reducing treatment, 0.1 to 2% fatty acid is added to mix, and the reducing treatment is executed at 150 to 500 deg.C.
申请公布号 JPH11310806(A) 申请公布日期 1999.11.09
申请号 JP19980118390 申请日期 1998.04.28
申请人 FUKUDA METAL FOIL & POWDER CO LTD 发明人 KAJITA OSAMU;NISHIDA MOTONORI;YOSHITAKE MASAYOSHI
分类号 B23K35/22;B22F1/02;B22F9/02;B22F9/22;C22C9/00;H01B1/00;H01B1/22;H05K1/09;H05K9/00;(IPC1-7):B22F9/02 主分类号 B23K35/22
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