| 摘要 |
<p>PROBLEM TO BE SOLVED: To move and attach an element directly onto a hybrid circuit board while protecting a micro-system from mechanical pressure by electrically connecting a plurality of external metallic sections and contact pads on the reverse side through a covering material and fitting the external metallic sections and the contact pads with the thickness of the covering material. SOLUTION: The element 10 is composed of two boards 12, 14 made of silicon. The active board 12 contains a plurality of contact pads 16, and represents an exposed metallic region. The passive board 14 has a groove 18 in front of the pads 16 for enabling an access bonded with the pads 16. The groove 18 is filled with a proper quantity of a resin covering 20, the resin covering 20 has a series of metallized sections 22 on an external surface, the metallized sections 22 exist in the same number as the pads 16, and each metallized section 22 corresponds to each pad 16. Each metallized section 22 and each pad 16 of interest are connected by connecting wires 24 respectively. Accordingly, the element is fitted so as to be moved and attached onto a main board consisting of a different substance from the material of the board.</p> |
