| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for connecting a first electronic component such as IC chip with a second electronic component such as a wiring board by a connecting part in a bump electrode configuration, and to provide a method for connecting the electronic components in which the aspect ratio of the connecting part can be increased, and a fine connecting part can be obtained. SOLUTION: A laminated structure 18, constituted of an electrically insulating layer 16 and a layer 17 to be removed, is formed on an IC wafer 13, and the laminated structure 18 is provided with a through-hole 19, through which an electrode 25 for connection can be exposed. The through-hole 19 is filled with a conductive adhesive 20, and then the layer 17 to be removed is removed. Then, each IC chip 11 is cut from the IC wafer 13, and the IC chip 11 is placed on a wiring board 12. Afterwards, the conductive adhesive 20 is made to harden, and when the electrically insulating layer 16 is made of thermosetting resin, this is also simultaneously hardened. |
