| 摘要 |
A package providing low stress mounting for semiconductor die having a base plate, a flexible printed wiring circuit wrapped around the base plate with a first portion of the flexible printed wiring circuit adhesively attached to an external side of the base plate and a cap attached to the periphery of the base plate forming a space between the base plate and the cap in which a second portion of the flexible printed wiring circuit is disposed. The space formed between the base plate and the cap is filled with air, a soft gel, or a material such as RTV. The semiconductor die are mounted on the portion of the flexible printed wiring circuit disposed in the space formed between the base plate and the cap. The portion of the flexible printed wiring circuit adhesively attached to the base plate has pads that communicate to an external device. The pads are in electrical communication with the semiconductor mounted on the flexible printed wiring circuit.
|
