发明名称 Semiconductor device using an SOI substrate
摘要 A semiconductor device includes an SOI substrate, trench memory cells including trench capacitors formed in the SOI substrate and a mesa or trench isolation region for isolating the trench memory cells. As a result, the trench memory cells are isolated more completely and soft errors are reduced.
申请公布号 US5982005(A) 申请公布日期 1999.11.09
申请号 US19970977030 申请日期 1997.11.25
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 HIDAKA, HIDETO;SUMA, KATSUHIRO;TSURUDA, TAKAHIRO
分类号 H01L21/8242;H01L21/02;H01L27/108;H01L27/12;H01L29/786;(IPC1-7):H01L27/01 主分类号 H01L21/8242
代理机构 代理人
主权项
地址