发明名称 |
Multilayer printed circuit board and process for producing and using the same |
摘要 |
A multilayer printed circuit board is obtained by impregnating a base material with a thermosetting resin in to form a prepreg; applying an undercoating agent comprising a terminal-bifunctional linear epoxy resin having an average epoxy equivalent of 450 to 6,000, together with at least one of 2-undecylimidazole, 1-cyanoethy1-2-undecylimidazole or 2,4-diamino-6{2'-undecyl-imidazole(1')}ethyl-s-triazine, or the aforementioned components together with an aromatic polyamine, to at least one circuit side of an interlayer circuit board on at least one side of which a circuit has been formed; and laying the prepreg on at least one side of the undercoating agent-applied interlayer circuit board and subjecting them to laminating.
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申请公布号 |
US5981041(A) |
申请公布日期 |
1999.11.09 |
申请号 |
US19960740321 |
申请日期 |
1996.10.28 |
申请人 |
SUMITOMO BAKELITE COMPANY LIMITED |
发明人 |
IKEGAYA, KUNIO;EGUSA, SHIGERU;TAKAHASHI, YOSHIYUKI |
分类号 |
H05K3/46;(IPC1-7):B32B9/00;H05K1/02 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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