| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layer printed circuit board with a high-accuracy high-density pattern in a shorter time and fewer processing steps. SOLUTION: A power feeding layer 3 made of conductive polymer film is formed on all the faces other than a conductive pattern 2 formed on a core board 1. After a plating resist is patterned, a pole-shaped conductor 5 is formed by electroplating. The plating resist 4 is peeled, and the power feeding layer 3 is removed. An interlayer insulating film 7 is applied thereon, and after the hardening, the surface thereof is polished to expose the face of the pole-shaped conductor 5 from the interlayer insulating film 7. Then, an electroless copper plating layer and an electroplating layer are formed on the surface of the board 1 and patterned with an etching resist to form a multi-layer printed circuit board. |
