| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating device of a structure, wherein a high throughput of a treatment of a substrate is obtained without increasing the operating speed of substrate carrying means, even under a carrying rate-determining situation. SOLUTION: A substrate is successively carried treating units P1, P2, P3, P4, P5 and P6 and continuous treatments of the substrate are performed. The units P1, P2 and P3 are classified as an area ER1, and the units P4, P5 and P6 are classified as an area ER2. With 'the carrying time within the area', which is the carrying time between the treating units in the respective interiors of the areas ER1 and ER2, specified 'the carrying time between the areas', which is the carrying time between the units between the areas ER1 and ER2, is specified. When the carrying of the substrate is carried out, the carrying is executed according to the above 'the carrying time within the area' and 'the carrying time between the areas'. The throughput of the treatment of the substrate can be enhanced in comparison with the throughput of the treatment of the substrate in the case where all of each carrying time between the treating units are evenly set to the carrying time between the treating units requiring the longest time among all the carrying times between the treating units. |
