ENCAPSULATION OF MICROELECTRONIC ASSEMBLIES

摘要

Microelectronic assemblies are encapsulated using disposable frames (72). The microelectronic assemblies (104) are disposed within an aperture (80) defined by a frame. The aperture is covered by top and bottom sealing layers (110, 112) so that the frame and sealing layers define an enclosed space encompassing the assemblies. The encapsulant is injected into this closed space. The frame is then separated from the encapsulation fixture and held in a curing oven. After cure, the frame is cut apart and the individual assemblies are severed from another. Because the frame need not be held in the encapsulation fixture during curing, the process achieves a high throughput.