| 摘要 |
<p>The invention relates to a vacuum pick-up nozzle (6) for use in a component-placement head of a component-placement machine. By means of the pick-up nozzle, components (9) to be placed on a printed circuit board can be picked up and held by a suction force. To increase the range of components which can be picked up by one nozzle, the nozzle opening (12) is provided with a gas-permeable cover (13) against which components of different sizes (9, 9a, 9b, 9c) can be sucked and held during operation.</p> |
