RESIN COMPOSITION FOR SEALING ELECTRONIC PARTS, ITS PRODUCTION AND SEALED ELECTRONIC PARTS USING THE RESIN FOR SEALING ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To obtain an electronic part-sealing resin composition of a thermoplastic resin excellent in moisture-resistant reliability together with moldability. SOLUTION: This resin composition for sealing electronic parts comprises a straight chain polyarylene sulfide resin, an inorganic ion exchanger, a graft copolymer, in which an olefin-based copolymer segment comprising anα-olefin unit and anα,β-unsaturated glycidyl ester unit and a polymer segment comprising a glycidyl ester unit of anα,β-unsaturated acid are chemically bonded in a cross-linked structure, and an inorganic filler.