PHYSICAL VAPOR DEPOSITION DUAL COATING APPARATUS AND PROCESS

摘要

A machine for covering a substrate by means of both cathodic arc plasma deposition (CAPD) and magnetron sputtering without breaking vacuum in a single chamber. A computer system monitors and controls all coating process parameters to coat in any sequence multiple thin film layers using either the CAPD or magnetron sputtering process. A rotating substrate table used in conjunction with internal and external targets coats both sides of the substrate simultaneously.