| 摘要 |
PURPOSE:To easily provide a micro semiconductor device having high toughness and high reliability. CONSTITUTION:A board 2 in which a circuit forming surface of a semiconductor element is directed downward, and micropins 3 arranged in the same array as that of electrode pads 7 of the element are passed to a lower surface side, is provided, the upper surface of the element is covered with a cap 5 adhered with a material having high modulus of elasticity in a state that a pressure is applied to the element, the tops of the pins 3 are electrically connected to the pads 7 of the element by the pressure, and the lower ends of the pins become external connecting terminal. The cap 5 and the board 2 are adhered by a brazing material 6 to be sealed. A material 4 having high modulus of elasticity is punched therein, and provided only at the top for adhering the pins 3 to the pads 7 to prevent crack of a chip. |
