| 发明名称 |
Diffusion bonding method and diffusion bonding apparatus |
| 摘要 |
A diffusion bonding method has a step of adjusting ends of material to be bonded before bonding the material after setting the materials in the diffusion bonding apparatus, whereas a diffusion bonding apparatus has a mechanism for finishing ends of materials to be bonded so that both ends face parallel to each other.
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| 申请公布号 |
US5975405(A) |
申请公布日期 |
1999.11.02 |
| 申请号 |
US19970845029 |
申请日期 |
1997.04.21 |
| 申请人 |
DAIDO TOKYSHUKO KABUSHIKI KAISHA |
发明人 |
TSUCHIYA, MASAKI;SHIMIZU, TAKAO;SUZUKI, HIROAKI |
| 分类号 |
B23K20/00;B23K20/02;B23K20/26;B23K35/00;C21D1/10;C21D1/74;(IPC1-7):B23K37/053 |
主分类号 |
B23K20/00 |
| 代理机构 |
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