A main wiping portion which contacts the back of a mask through a cleaning paper is provided behind a suction port as viewed in the direction of movement of an air suction portion. The cleaning paper is able to wipe off both solder paste adhered on the back of the mask and solder paste discharged from openings of the mask by suction through the suction port, whereby the solder paste deposits on the mask can be cleaned off at high removal efficiency.
申请公布号
US5976269(A)
申请公布日期
1999.11.02
申请号
US19970942111
申请日期
1997.10.01
申请人
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人
HAMASAKI, KURAYASU;YAMAUCHI, TOSHIAKI;OKANOUE, KAZUE;ISHIMOTO, KAZUMI;TAKAHASHI, KEN;NAITO, TAKAO;MITSUSHIRO, KOJI