发明名称 Semiconductor device having multilayer film carrier
摘要 A semiconductor device includes multilayer film carriers, a plurality of connection layers having innerleads protruded from the film carriers, and a semiconductor chip having electrode pads connected to the innerleads.
申请公布号 US5977617(A) 申请公布日期 1999.11.02
申请号 US19970854883 申请日期 1997.05.12
申请人 NEC CORPORATION 发明人 KATA, KEIICHIRO
分类号 H01L21/60;H01L23/12;H01L23/495;(IPC1-7):H01L23/495 主分类号 H01L21/60
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