| 摘要 |
A semiconductor package and a socket thereof that are easily adaptable to a multiple pin structure includes a nonconductive base layer, a plurality of conductive metallic leads that extend vertically through the base layer, a wiring layer in which a pattern of fine metallic wires are formed to electrically couple to the conductive metallic leads to a semiconductor chip mounted in the package, a recess formed in the central portion of the wiring layer, and a cover for closing the upper portion of the recess. A semiconductor chip is mounted on the bottom portion of the recess, and conductive wires electrically couple the semiconductor chip to the fine metallic wires of the wiring layer. A socket for receiving the semiconductor package includes a socket body, a first plurality of socket pins arranged to couple with leads on a bottom surface of a semiconductor chip package mounted in the socket, a second plurality of socket pins arranged to couple with leads on peripheral side surfaces of a semiconductor chip package mounted in the socket, and a hinged cover. |
