发明名称 CERAMIC ELECTRONIC COMPONENT AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To prevent a ceramic electronic component from being mechanically damaged due to expansion and contraction of a wiring board, when the ceramic electronic component is mounted on the wiring board. SOLUTION: Terminal electrodes 5 is made to have respectively at least a three-layered structure, which is made by sequentially forming a first layer 7, a second layer 8 and a third layer 9 on both ends of an electronic component body 3. The second layer 8 has a porous structure by which the stress due to the expansion and contraction of a wiring board is advantageously absorbed, and stress is prevented from reaching the electronic component body 3. The first layer 7 which is not porous structure ensures good electrical conduction with inner electrodes 6. Similarly the third layer 9 which does not have porous structure prevents the penetration of plating liquid and ensures good electrical conduction with the outside.
申请公布号 JPH11297565(A) 申请公布日期 1999.10.29
申请号 JP19980094518 申请日期 1998.04.07
申请人 MURATA MFG CO LTD 发明人 OZASA TOSHIAKI
分类号 H01G4/252;H01G4/232;H01G4/30;H05K3/34;(IPC1-7):H01G4/30 主分类号 H01G4/252
代理机构 代理人
主权项
地址